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US 2002/0001955 A1Published application
Removal of residue from a substrate
AssigneeIntel Corporation
InventorsLI-SHUN WANG, JOHN CHU
Life of this patent
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Abstract
A method and an apparatus of removing a particle from a metal layer over a substrate is disclosed. The method comprises introducing a slurry onto the metal layer and polishing the metal layer. A solution comprising hydrogen peroxide is introduced onto the metal layer and at least one particle is removed from the metal layer.
Claims22
A method of removing a particle from a metal layer over a substrate comprising:
- depositing a first agent onto the substrate;
- polishing the metal layer with the first agent;
- and
- introducing a second agent comprising hydrogen peroxide onto the metal layer.
1 more element
A method of removing at least one particle from a portion of a metal layer on a substrate comprising:
- depositing a slurry onto the substrate;
- polishing the metal layer and the substrate;
- and
- rinsing the substrate with a solution comprising hydrogen peroxide.
1 more element
A method of polishing a metal layer on a substrate comprising:
- polishing the metal layer and introducing a rinsing solution onto the metal layer, the rinsing solution comprising hydrogen peroxide.
Dependencies are inferred from the claim text.