High-frequency module, method of manufacturing thereof and method of molding resin
AssigneeFujitsu Limited
InventorKazuhiko Kobayashi
Life of this patent
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Abstract
A method of molding resin on a thin-film resin substrate having a first surface provided with an electronic circuit and a second unleveled surface opposite the first surface is disclosed. The method includes the steps of: a) providing deformation restricting means for the substrate; and b) molding the resin on the first surface.
Claims38
A method of molding resin on a substrate having a first surface provided with an electronic circuit and a second unleveled surface opposite said first surface, said method comprising the steps of:
- a) providing deformation restricting means for said substrate;
- and
- b) molding said resin on said first surface.
A method of molding resin on a thin-film resin substrate having a first surface provided with an electronic circuit and a second unleveled surface opposite said first surface, said second surface having raised portions and recessed portions, said method comprising the steps of:
- a) providing deformation restricting means for said substrate;
- and
- b) molding said resin on said first surface.
A method of molding resin on a thin-film resin substrate having a first surface provided with an electronic circuit and a second unleveled surface opposite said first surface, said second surface having raised portions serving as electrodes and recessed portions, said method comprising the steps of:
- a) molding said resin on said first surface;
- and
- b) after said step a), forming said electrodes on said second surface.
A method of manufacturing a module, said method comprising the steps of:
- a) preparing a substrate having a first surface provided with an electronic circuit and a second unleveled surface opposite said first surface;
- b) providing deformation restricting means for said substrate;
- c) placing said substrate in a mold;
- d) injecting resin into said mold.
A method of manufacturing a high-frequency module, said method comprising the steps of:
- a) preparing a thin-film resin substrate having a first surface provided with an electronic circuit and a second unleveled surface opposite said first surface;
- b) providing deformation restricting means for said thin-film resin substrate;
- c) placing said thin-film resin substrate in a mold and said deformation restricting means;
- d) injecting resin into said mold.
A method of manufacturing a high-frequency module, said method comprising the steps of:
- a) preparing a thin-film resin substrate having a first surface provided with an electronic circuit and a second unleveled surface opposite said first surface;
- b) providing deformation restricting means for said thin-film resin substrate;
- c) placing said thin-film resin substrate in a mold and said deformation restricting means;
- d) injecting resin into said mold.
A thin-film resin substrate used in a high-frequency module, said thin-film resin substrate having a first surface provided with an electronic circuit and a second unleveled surface opposite said first surface, said second surface including raised portions and recessed portions, wherein said electronic circuit is designed such that at least some of its interconnections extend over regions corresponding to said recessed portions.
A module comprising:
- a substrate having a first surface provided with high-frequency circuit components including high-frequency circuit connections and a second unleveled surface opposite said first surface;
- a resin sealing formed on said first surface of said thin-film resin substrate;
- and
- deformation restricting means.
A high-frequency module comprising:
- a thin-film resin substrate having a first surface provided with high-frequency circuit components including high-frequency circuit connections and a second unleveled surface opposite said first surface, said second surface having raised portions and recessed portions;
- a resin sealing formed on said first surface of said thin-film resin substrate;
- and
- deformation restricting means.
A high-frequency module comprising:
- a thin-film resin substrate having a first surface provided with high-frequency circuit components including high-frequency circuit connections and a second unleveled surface opposite said first surface, said second surface having raised portions serving as electrodes and recessed portions;
- a resin sealing formed on said first surface of said thin-film resin substrate so as to seal said high-frequency circuit interconnections and said high-frequency circuit components;
- and
- deformation restricting means.
Dependencies are inferred from the claim text.