Method for performing photolithography
AssigneeAgilent Technologies, Inc.
InventorsTetsuya Hidaka, Yawara Kaneko
Life of this patent
Estimating the term…
Loading patent…
AssigneeAgilent Technologies, Inc.
InventorsTetsuya Hidaka, Yawara Kaneko
Estimating the term…
A method for generating a photoresist pattern on top of an object that includes a layer of material that is opaque to light of a predetermined wavelength. The object is first covered with a layer of photoresist material. The layer of photoresist material is then irradiated with light of the predetermined wavelength from a position under the object such that the object casts a shadow into the layer of photoresist. The photoresist material is then developed to generate the photoresist pattern. The layer of photoresist material is irradiated from below the object by providing a reflecting surface below the object and a light source above the object. A mask is positioned between the object and the light source such that the mask casts a shadow that covers the object and a portion of the area surrounding the object. The method of the invention is well suited for depositing a layer of dielectric material over a device in which the dielectric layer has a via therethrough terminating on a metallic pad that is part of the device.
A method for generating a photoresist pattern on top of an object comprising a layer of material that is opaque to light of a predetermined wavelength, said method comprising:
A method for depositing a layer of dielectric material over a device, said dielectric layer having a via therethrough terminating on a metallic pad that is part of said device, said method comprising:
The method of claim 5, wherein said substrate is sapphire.
Dependencies are inferred from the claim text.