Optomodule and connection configuration
AssigneeInfineon Technologies AG
InventorKarl Schroedinger
Life of this patent
Estimating the term…
Abstract
An optomodule has a carrier substrate; wiring applied on a front side of the carrier substrate; contacts configured on a rear side of the carrier substrate and electrically connecting to a line of the wiring via at least one plated-through hole formed in the carrier substrate; and an optosemiconductor for transmitting and/or for receiving light. The optosemiconductor electrically contacts the line of the wiring and is configured on a front side of the carrier substrate in the region of a through opening formed in the carrier substrate, in such a way that the light can be transmitted and/or received through the through opening.
Claims25
An optomodule comprising:
- a carrier substrate having a front side, a rear side, and a plated-through opening formed therein;
- wiring applied on said front side of said carrier substrate having at least one line;
- contacts configured on said rear side of said carrier substrate and electrically connected to a line of said wiring via said plated-through opening;
- and
- an optosemiconductor for transmitting and receiving light, said optosemiconductor electrically contacting said line of said wiring and being configured on said front side of said carrier substrate near said through opening formed in said carrier substrate, for transmitting and receiving the light through said through opening.
A connection configuration, comprising:
- an optomodule including a carrier substrate having a front side and a rear side and a plated-through opening formed therein, wiring applied on said front side of said carrier substrate having at least one line, contacts configured on said rear side of said carrier substrate and electrically connected to a line of said wiring via said plated-through opening, and an opt:osemiconductor for transmitting and receiving light, said optosemiconductor electrically contacting said line of said wiring and being configured on said front side of said carrier substrate near said through opening formed in said carrier substrate, for transmitting and receiving the light through said through opening;
- and
- a printed circuit board section having wiring;
- said contacts electrically contacting said wiring of said printed circuit board section and said optomodule and said contacts mounted on said printed circuit board section to permit light to be passed through an opening in said printed circuit board section.
Dependencies are inferred from the claim text.