Back to results
US 2002/0001323 A1Published application
Semiconductor laser unit employing an inorganic adhesive
AssigneeFuji Photo Film Co., Ltd.
InventorMasanori Sasao
Life of this patent
Estimating the term…
Abstract
Disclosed herein is a semiconductor laser unit equipped with a semiconductor laser chip mounted within a package, a temperature sensing component fixed within the package, and an optical component fixed within the package. At least either the fixation of the temperature sensing component or the fixation of the optical component is performed with an inorganic adhesive.
Claims11
A semiconductor laser unit comprising:
- a semiconductor laser chip mounted within a package;
- a temperature sensing component fixed within said package;
- and
- an optical component fixed within said package;
- wherein at least either the fixation of said temperature sensing component or the fixation of said optical component is performed with an inorganic adhesive.
2 more elements
Dependencies are inferred from the claim text.