Light emitting device

A light emitting device comprising:

• an insulating base having an upper surface and a lower surface;
• a metal layer provided on the upper surface and the lower surface of the insulating base;
• a plurality of light emitting elements arranged on the metal layer provided on the upper surface of the insulating base;
• and
• a metal connection that connects the metal layers to each other at a position where at least one of the plurality of light emitting elements is disposed.

A light emitting device comprising:

• a substrate comprising a plurality of leads provided on an insulating base;
• a plurality of light emitting elements arranged on a base line along a surface of the substrate in a predetermined direction;
• and
• a plurality of bonding wires configured to connect the plurality of light emitting elements to the plurality of leads in the predetermined direction or on one side relative to the base line.

A light emitting device comprising:

• a first metal layer provided on an upper surface of an insulating base;
• a second metal layer provided on a lower surface of the insulating base;
• a plurality of light emitting elements arranged along a base line on a surface of the first metal layer in a predetermined direction;
• a metal connection configured to connect the first and second layers to one another at a position where a predetermined light emitting element of the plurality of light emitting elements is disposed;
• and
• a plurality of bonding wires configured to connect the plurality of light emitting elements to the first metal layer in the predetermined direction or on one side relative to the base line.

A light emitting device for driving a plurality of LED chips disposed in an array to emit a mixed light composed of lights emitted from the plurality of LED chips, said light emitting device comprising:

• an LED chip connection lead provided on the upper surface of an insulating base;
• a power supply connection lead provided on the lower surface of the insulating base;
• and
• a link lead configured to connect the LED chip connection lead to the power supply connection lead between the upper and lower surfaces of the insulating base,
• wherein the LED chip connection lead comprises a plurality of separate leads connected respectively to the plurality of LED chips and a common lead connected to the plurality of LED chips by a common connection, the common lead being loaded with the plurality of LED chips and configured to absorb heat generated from the plurality of LED chips.