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US 2002/0001159 A1Published application
Magnetic head device having resin stop structure preventive of flowing and scattering of insulating resin
AssigneeAlps Electric Co., Ltd.
InventorHideto Ando
Life of this patent
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Abstract
A magnetic head device has a wiring board on which are formed first electrode pads connected to a head chip through lead wires and second electrode pads electrically connected to the first electrode pads and arranged for external connection. The lead wires connected to the first electrode pads are covered with an insulating resin. An aperture is formed in the wiring board so as to lie between the first electrode pads and the second electrode pads.
Claims6
A magnetic head device, comprising:
- a head chip;
- a head base carrying said head chip;
- a wiring board fixed to said head base and having first electrode pads and second electrode pads formed thereon, said first electrode pads being electrically connected to said head chip via lead wires extending from said head chip, said second electrode pads being electrically connected to said first electrode pads and being arranged for external connection;
- an insulating resin covering said lead wires connected to said first electrode pads;
- and
- a resin-flow stopping structure disposed between said first electrode pads and said second electrode pads.
3 more elements
Dependencies are inferred from the claim text.