Back to results
US 2002/0001020 A1Published application
Heater chip module for use in an ink jet printer
OwnerJames Michael Mrvos, Ashok Murthyinventors
Life of this patent
Estimating the term…
Abstract
A heater chip module is provided comprising a carrier adapted to be secured to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes a support section provided with at least one passage which defines a path for ink to travel from the container to the heater chip. The heater chip is secured at its base to the support section.
Claims31
A heater chip module comprising:
- a rigid carrier adapted to be secured to a container for receiving ink and including a support section;
- a heater chip coupled to said carrier support section, said support section including at least one passage which defines a path for ink to travel from the container to said heater chip;
- and
- a nozzle plate coupled to said heater chip.
1 more element
A flexible circuit/heater chip module assembly comprising:
- a heater chip module including a carrier adapted to be secured to a container for receiving ink and including a support section, a heater chip coupled to said carrier support section, and a nozzle plate coupled to said heater chip, said support section including at least one passage which defines a path for ink to travel from the container to said heater chip;
- and
- a flexible circuit coupled to said heater chip.
An ink jet print cartridge comprising:
- a container adapted to receive ink;
- a heater chip module including a substantially rigid carrier secured directly to said container and including a support section, a heater chip coupled to said carrier support section, and a nozzle plate coupled to said heater chip, said support section including at least one passage which defines a path for ink to travel from the container to said heater chip;
- and
- a flexible circuit coupled to said heater chip.
1 more element
A flexible circuit/heater chip assembly comprising:
- a heater chip having a base with first and second outer surfaces and at least one bond pad provided on said first base surface;
- a nozzle plate coupled to said heater chip so as to be adjacent to said first base surface;
- and
- a flexible circuit including a substrate portion and at least one conductor trace on said substrate portion, said at least one conductor trace having a section which is wire-bonded to said bond pad on said heater chip base such that a wire extends from said trace section to said bond pad.
1 more element
Dependencies are inferred from the claim text.