Connecting structure and frequency adjusting method therein
AssigneesFdk Corporation, Hiroyuki Arai
InventorsTakashi Tamura, Naoki Atsumi, Hiroyuki Arai, Hajime Izumi
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AssigneesFdk Corporation, Hiroyuki Arai
InventorsTakashi Tamura, Naoki Atsumi, Hiroyuki Arai, Hajime Izumi
Estimating the term…
A connecting structure for high frequency circuits is provided, with which components can be readily replaced, and which does not require high assembly accuracy and is applicable in a broad band. First and second circuit boards each having strip lines on the top surfaces are placed to secure a gap. Patch portions each constituting a resonator are formed by extending the width of the strip lines, and a supporting member of a foam material is placed on the top of the patch portion formed on the first circuit board such that a parasitic element made of a dielectric material is cantilevered by the supporting member. The free end side of the parasitic element is placed above the patch portion formed on the second circuit board while securing a predetermined space. A strong electrical connection is established by the parasitic element that electromagnetically couples non-continuing portions, thereby making it possible to cut a direct current.
A connecting structure for first and second high frequency circuit elements each provided with a dielectric substrate having a transmission line made out of a conductive film on a top surface thereof, wherein:
Dependencies are inferred from the claim text.