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US 2002/0000652 A1Published application
Board on chip ball grid array
AssigneeTexas Instruments Incorporated
InventorJING S. GOH
Life of this patent
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Abstract
A package for an integrated circuit includes a circuit board 122 for mounting the integrated circuit 114 having a first surface and a second surface, a connection device positioned on the first surface of the circuit board 122 for electrically connecting the integrated circuit 114 and the integrated circuit 114 being positioned on the second surface of the integrated circuit 114.
Claims8
A package for an integrated circuit, comprising:
- a circuit board for mounting the integrated circuit having a first surface and a second surface;
- a connector device positioned on the first surface of the circuit board for electrically connecting the integrated circuit;
- and
- said integrated circuit being positioned on the second surface.
1 more element
Dependencies are inferred from the claim text.