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US 2002/0000639 A1Published application
Semiconductor device with inductance element
AssigneeKabushiki Kaisha Toshiba
InventorsTetsuo Inoue, Takao Ito
Life of this patent
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Abstract
A semiconductor device with an inductance element reduces eddy current in a conductive element and secures required inductance. The semiconductor device includes a semiconductor chip and the inductance element of flat structure formed on a surface of the semiconductor chip. The semiconductor chip is fixed to the conductive element, to form a package. The element has a magnetic material to face the semiconductor chip.
Claims20
A semiconductor device comprising:
- a semiconductor chip;
- an inductance element of flat structure formed above a first surface of the semiconductor chip;
- and
- a magnetic material formed below a second surface of the semiconductor chip opposite to the first surface.
1 more element
A semiconductor device comprising:
- a semiconductor chip;
- an inductance element of flat structure formed above a surface of the semiconductor chip;
- a passivation film covering the inductance element;
- and
- a magnetic material arranged on the passivation film.
2 more elements
A semiconductor device comprising:
- a substrate;
- a magnetic-material-containing wiring pattern formed on a surface of the substrate;
- a semiconductor chip arranged on the wiring pattern;
- and
- an inductance element of flat structure formed above a surface of the semiconductor chip.
2 more elements
Dependencies are inferred from the claim text.