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US 2002/0000430 A1Published application
Laser processing apparatus and method
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsIzuru Nakai, Toshiharu Okada, Haruhiro Yuki, Ken Muneyuki
Life of this patent
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Abstract
In a laser processing apparatus including a laser oscillator for emitting laser light onto a workpiece through an fθ lens for drilling a hole in the workpiece, a wavelength selector for passing only a light ray having a specific wavelength is disposed between the laser oscillator and the workpiece.
Claims12
A laser processing apparatus, comprising:
- a laser oscillator for emitting laser light;
- an fθ lens positioned relative to the laser oscillator for converging the emitted laser light onto a workpiece;
- and
- a wavelength selector interposed between the laser oscillator and the fθ lens for separating a light ray having a specified wavelength out of the laser light.
1 more element
A laser processing apparatus, comprising:
- a laser oscillator for emitting laser light;
- an fθ lens positioned relative to the laser oscillator for converging the emitted laser light onto a workpiece;
- a scanning member for guiding the laser light into the fθ lens in a scanning manner;
- and
- a wavelength selector interposed between the laser oscillator and the fθ lens for separating a light ray having a specified wavelength from the laser light.
2 more elements
A laser processing method comprising:
- emitting laser light from a laser oscillator;
- separating a light ray having a specified wavelength out of the laser light by a wavelength selector;
- and
- converging the separated light ray using an fθ lens onto a workpiece for machining the workpiece.
1 more element
Dependencies are inferred from the claim text.