Semiconductor sensor device and method of manufacturing the same

A method of manufacturing a semiconductor chip having semiconductor elements, the method comprising:

• forming a plurality of semiconductor chips and peripheral grooves for separating the semiconductor chips into individual pieces on a first surface of a semiconductor substrate, each peripheral groove surrounding an outer periphery of each semiconductor chip;
• pasting a protecting sheet on the first surface of the semiconductor substrate so that the protecting sheet is bent along bottom walls of the peripheral grooves;
• and
• dicing the semiconductor substrate from a second surface of the semiconductor substrate along the peripheral grooves to separate the semiconductor chips into individual pieces.

A semiconductor dynamic sensor chip separated by dicing a semiconductor substrate having plural semiconductor dynamic sensor chips formed on a first surface thereof and covered with a protecting sheet, the dicing being performed from a second surface of the semiconductor substrate, the semiconductor dynamic sensor chip comprising:

• movable electrodes responsive to dynamic force imposed thereon;
• stationary electrodes facing the movable electrodes so that a capacitance formed between the movable electrodes and the stationary electrodes changes according to the dynamic force;
• a peripheral ditch formed between an outer peripheral bank and a field portion of the semiconductor dynamic sensor chip;
• and
• a member for electrically connecting the outer peripheral bank and the field portion.

A method of manufacturing a semiconductor dynamic sensor chip having movable electrodes responsive to dynamic force imposed thereon and stationary electrodes facing the movable electrodes, a capacitance formed between the movable electrodes and stationary electrodes being changed in response to the dynamic force, the method comprising:

• forming a plurality of semiconductor dynamic sensor chips, peripheral ditches surrounding each sensor chip and peripheral banks further surrounding each ditch on a first surface of a semiconductor substrate;
• electrically connecting the peripheral bank to an inner portion of each sensor chip;
• pasting a protecting sheet on the first surface of the semiconductor substrate;
• and
• dicing the semiconductor substrate from a second surface of the semiconductor substrate along the peripheral banks, thereby separating the plurality of sensor chips into individual pieces.