Back to results
US 2001/0055835 A1Published application
Flip chip interconnection structure
AssigneeChipPAC, Inc.
InventorRajendra D. Pendse
Life of this patent
Estimating the term…
Abstract
A flip chip interconnection structure is formed by mechanically interlocking joining surfaces of a first and second element. The first element, which may be a bump on an integrated circuit chip, includes a soft, deformable material with a low yield strength and high elongation to failure. The surface of the second element, which may for example be a substrate pad, is provided with asperities into which the first element deforms plastically under pressure to form the mechanical interlock.
Claims17
A method for forming a flip chip interconnection structure, comprising
- providing a first member on an IC chip and a second member on a substrate, the first member comprising a deformable material having a low yield strength and a high elongation to failure and the second member having surface asperities on the part to be bonded with the first member;
- and
- pressing the first and second members against one another using a force sufficient to cause plastic flow of part of the first member into asperities on the second member.
A flip chip interconnection structure, comprising
- a first member attached to a chip and a second member attached to a substrate, the first member being of a deformable material and the first and second members being bonded by mechanical interlocking of the deformable material of the first member with asperities on the surface of the second member.
Dependencies are inferred from the claim text.