Laser marking techniques
OwnerTim J. Corbettinventor
Life of this patent
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Abstract
A laser marking apparatus and method for marking the surface of a semiconductor chip are described herein. A laser beam is directed to a location on the surface of the chip where a laser reactive material, such as a pigment containing epoxy, is present. The heat associated with the laser beam causes the laser reactive material to fuse to the surface of the chip, creating a visibly distinct mark in contrast to the rest of the surface of the chip. Only reactive material contacted by the laser fuses to the chip surface, and the remaining residue on the non-irradiated portion can be readily removed.
Claims23
In a method of producing semiconductor chips wherein the chips are at least fabricated and characterized, the improvement comprising:
- marking with identifying indicia only those chips which are characterized for use.
A method for producing semiconductor chips, comprising:
- fabricating at least one semiconductor chip;
- determining whether said at least one semiconductor chip is suitable for use;
- and
- marking said at least one semiconductor chip only if said at least one semiconductor chip is determined to be suitable for use.
A method for producing semiconductor chips, comprising:
- providing at least one semiconductor chip which has been characterized as suitable for use and at least one semiconductor chip which has been characterized as unsuitable for use;
- and
- marking with identifying indicia only the at least one semiconductor chip which has been characterized as suitable for use.
Dependencies are inferred from the claim text.