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US 2001/0055685 A1Published application
Conductive filler and making method
OwnerMasami Kaneyoshiinventor
Life of this patent
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Abstract
A conductive filler is provided in the form of non-conductive particles which are surface coated with a plating layer of copper, copper alloy, nickel or nickel alloy, which is, in turn, coated with an electroplating layer of gold, gold alloy, silver or silver alloy. The conductive powder has a high conductivity, durability, especially oxidation resistance, and a relatively low specific gravity.
Claims5
A conductive filler comprising non-conductive particles which are coated on their surface with a plating layer of copper, copper alloy, nickel or nickel alloy, which is, in turn, coated with an electroplating layer.
Dependencies are inferred from the claim text.