Surface acoustic wave device and method for making the same
AssigneeMurata Manufacturing Co., Ltd.
InventorMichio Kadota
Life of this patent
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Abstract
A surface acoustic wave device includes a SAW element that is mounted on a substrate. Grooves are provided in the substrate at the outer periphery of the SAW element, and a flexible resin layer is provided at the inner portion of the grooves so as to cover the SAW element. An outer resin layer that is harder than the flexible resin layer is provided at the exterior of the flexible resin layer. This configuration facilitates reduction in size and profile of the surface acoustic wave device, contributes to reduction in cost, and exhibits high environmental resistance.
Claims21
A surface acoustic wave device comprising:
- a substrate;
- a surface acoustic wave element mounted on the substrate, the substrate being provided with at least one first groove thereof at the exterior of the surface acoustic wave element;
- an inner resin layer provided on the substrate between the surface acoustic wave element and the first groove so as to cover the surface acoustic wave element;
- and
- an outer resin layer provided at the exterior of the inner resin layer, the outer resin layer being harder than the inner resin layer.
A method for making surface acoustic wave devices comprising the steps of:
- preparing a mother substrate having a plurality of first grooves on the upper surface thereof;
- mounting surface acoustic wave elements onto the mother substrate so that the first grooves are located at the exterior of the surface acoustic wave elements;
- forming an inner resin layer on the substrate between the surface acoustic wave elements and the first grooves so as to cover each of the surface acoustic wave elements;
- covering the inner resin layer with an outer resin layer of a relatively hard resin;
- and
- cutting the outer resin layer and the mother substrate into individual surface acoustic wave devices.
Dependencies are inferred from the claim text.