Method and apparatus for forming deposition film, and method for treating substrate
AssigneeCanon Kabushiki Kaisha
InventorsHideo Tamura, Masahiro Kanai, Yasuyoshi Takai, Hiroshi Shimoda, Hidetoshi Tsuzuki
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Abstract
A gas adsorptive member is disposed in a space communicating with film deposition chambers, and deposition films are deposited while continuously feeding gas components released from this member, thereby enabling the high quality and uniform deposition films to be formed on the substrate with good reproducibility.
Claims11
A method for forming a deposition film on a substrate in a film deposition chamber, wherein a gas adsorptive member is placed in a space communicating with the film deposition chamber, the deposition film being deposited while continuously feeding a released gas component generated from the member into the space.
An apparatus for forming a deposition film on a substrate in a film deposition chamber, comprising a gas adsorptive member disposed in a space communicating with a film deposition chamber, and means for continuously feeding a released gas component generated from the gas adsorptive member in the space.
A method for treating a substrate comprising the steps of reeling off a rolled substrate in a first vacuum chamber, treating the substrate, and reeling up the substrate on a roll in a second vacuum chamber, wherein a rolled surface protection sheet is placed in the second vacuum chamber to reel up the sheet on the same axis as the axis of the rolled substrate while reeling off the sheet for releasing the gas from the surface of the sheet.
Dependencies are inferred from the claim text.