Hybrid alignment using calibrated substrates
OwnerDaniel Delprat, Manuel Fendler +1inventors
InventorsDaniel Delprat, Manuel Fendler, Anatolie Lupu
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Abstract
An optical apparatus (10) is provided including a first chip (12) having at least one alignment feature (24, 240) in the first chip (12) at a pre-selected location. A second chip (14) has a plurality of alignment couplers (18, 340) formed in the second chip (14) at pre-selected locations relative to the at least one feature (24, 240), wherein one of the plurality of couplers (18, 340) of the second chip (14) is coupled to the at least one feature (24, 240) of the first chip (12).
Claims20
An optical apparatus comprising:
- a first chip having at least one mating member in said first chip at a pre-selected location;
- and
- a second chip having a plurality of receiving members formed therein at pre-selected locations relative to said at least one mating member, wherein one of said plurality of receiving members of said second chip is coupled to said at least one mating member of said first chip.
A method of interconnecting a pair of chips comprising:
- providing a first chip;
- forming at least one projection in said first chip at a pre-selected location;
- providing a second chip;
- forming a plurality of recesses on said second chip at pre-selected locations relative to said at least one projection;
- positioning said at least one projection proximate said plurality of recesses;
- and
- assembling said first and second chips to move said first chip relative to said second chip until said at least one projection enters one of said plurality of recesses.
An optical apparatus comprising:
- a first chip having an optical waveguide and at least one projection in said first chip at a pre-selected location from said optical waveguide;
- and
- a second chip having a plurality of recesses formed therein at pre-selected locations relative to said at least one projection, wherein one of said plurality of recesses of said second chip is coupled to said at least one projection of said first chip.
Dependencies are inferred from the claim text.