Coil apparatus and manufacturing method for the same

A coil apparatus comprising:

• a substrate for mounting electronic components;
• a coil pattern formed on the substrate;
• a pair of core members mounted on the substrate so as to sandwich a part of the coil pattern therebetween from top and bottom sides of the substrate, at least one of the pair of core members having core legs;
• through-holes for inserting the core legs formed in a portion of the substrate inside the coil pattern section and in at least a portion of the substrate outside the coil pattern;
• a core-combining member for holding the pair of core members together so that the core members are movable with respect to each other in directions along the substrate, by clamping one core member from the top side of the substrate and the other core member from the bottom side of the substrate, the core-combining member passing from the top to the bottom of the substrate via the through-holes;
• and
• a cover member arranged to be fixed to the substrate,
• wherein the cover member has a surface which holds the core-combining member so as to separate the core members from the substrate resulting in a non-contact state therebetween, by forming a space between opposing faces of the substrate and the core members when held by the core-combining member.