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US 2001/0054556 A1Published application
Metal plating apparatus and process
AssigneeInternational Business Machines Corporation
InventorsJohji Nakamoto, Tatsuji Yamada
Life of this patent
Estimating the term…
Abstract
In order to make plating thickness uniform in a metal plating apparatus, a metal plating apparatus capable of performing metal plating to a uniform thickness is provided by aligning lines of electric force uniformly and in parallel by disposing a pair of conductive perforated plates 20a and 20b, which are electrically connected to each other, between plating metals 16 immersed in a plating solution and an object 18 to be plated.
Claims34
A metal plating apparatus comprising:
- a source material electrically connected to a first terminal of a power supply;
- an object to be plated electrically connected to a second terminal of the power supply;
- and
- at least a pair of conductive perforated plates electrically connected to each other, and the at least pair of conductive perforated plates are disposed between the source material and the object.
1 more element
A metal plating apparatus comprising:
- a source material electrically connected to a first terminal of a power supply;
- an object having a plurality of portions to be plated, the object electrically connected to a second terminal of the power supply;
- and
- an insulating adjustment plate disposed between the source material and the object in the vicinity of the object, wherein a plurality of windows are provided in said insulating adjustment plate corresponding to the plurality of portions of the object to be plated.
1 more element
A method of forming an equi-voltage surface for plating an object comprising:
- providing lines of electric field which are directed to a surface of the object;
- and
- adjusting the lines of electric field to provide parallel lines of electric field terminating on the surface of the object.
Dependencies are inferred from the claim text.