Polishing apparatus
AssigneesEbara Corporation, Mitsubishi Materials Corporation
InventorsSeiji Katsuoka, Masahiko Sekimoto, Mitsuru Miyazaki, Naoki Noji, Kazuki Chiba, Kenji Fujimoto
Life of this patent
Estimating the term…
Loading patent…
AssigneesEbara Corporation, Mitsubishi Materials Corporation
InventorsSeiji Katsuoka, Masahiko Sekimoto, Mitsuru Miyazaki, Naoki Noji, Kazuki Chiba, Kenji Fujimoto
Estimating the term…
A multi-head type polishing apparatus has a plurality of top rings for holding workpieces with respect to a single polishing table. A polishing apparatus includes a polishing table having a polishing surface, a plurality of top rings for holding workpieces and pressing the workpieces against the polishing surface, and a carousel for supporting the top rings and indexing the top rings. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by the top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces, and a pusher for transferring the workpieces between the rotary transporter and the top rings.
A polishing apparatus having a multi-head, comprising:
A polishing apparatus having a multi-head, comprising:
A polishing apparatus comprising:
Dependencies are inferred from the claim text.