Polish pad with non-uniform groove depth to improve wafer polish rate uniformity

A method for creating a differential polish rate across a wafer comprising:

• determining the profile of said wafer, said wafer profile having high points and low points;
• providing a polish pad having a plurality of grooves;
• adjusting the groove width of said polish pad, wherein said groove width is increased in the areas of said polish pad that correspond to the high points of said wafer profile;
• and
• polishing said wafer with said polish pad.

A method for creating a differential polish rate across a wafer comprising:

• determining the profile of said wafer, said wafer profile having high points and low points;
• providing a polish pad having a plurality of grooves;
• increasing the polish rate of said polish pad in the areas of said polish pad that correspond to the high points of said wafer profile;
• and
• polishing said wafer with said polish pad.

A polish pad for creating a differential polish rate across a wafer comprising:

• said polish pad having a plurality of grooves;
• said grooves having an increased depth in areas that correspond to high points on the surface of said wafer;
• and
• said grooves having a decreased depth in areas that correspond to low points on the surface of said wafer.

A polish pad for creating a differential polish rate across a wafer comprising:

• said polish pad having a plurality of grooves;
• said grooves having an increased width in areas that correspond to high points on the surface of said wafer;
• and
• said grooves having a decreased width in areas that correspond to low points on the surface of said wafer.

A polish pad for creating a differential polish rate across a wafer comprising:

• said polish pad having a plurality of grooves;
• said grooves having an increased density in areas that correspond to high points on the surface of said wafer;
• and
• said grooves having a decreased density in areas that correspond to low points on the surface of said wafer.