Film forming apparatus and film forming method
OwnerMasami Akimoto, Yoichi Deguchiinventors
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Abstract
In a method of fabricating a conductive layer in an insulating film using a damascene process, a copper film is formed on a wafer in a copper formation processing chamber of a film forming apparatus, and then CMP processing is performed for the wafer in a CMP processing chamber. After the CMP processing, the wafer is subjected to cleaning processing in a cleaning chamber, and dried under reduced pressure in a reduced-pressure drying chamber. The wafer which has been subjected to the reduced-pressure drying processing is carried into a CVD unit under reduced pressure, thereby securely suppressing natural oxidization of the copper film formed on the wafer. This can prevent the oxidization of a conductive material as much as possible.
Claims22
A film forming apparatus, comprising:
- a drying chamber for drying a cleaned substrate under a reduced pressure;
- a film forming chamber for forming a film on the substrate by a CVD method under a reduced pressure;
- and
- a transfer path for transferring the substrate under a reduced pressure from the drying chamber to the film forming chamber.
A film forming method, comprising the steps of:
- drying a cleaned substrate under a reduced pressure;
- transferring the substrate with the reduced-pressure state kept after the reduced-pressure drying;
- and
- forming a film on the substrate by a CVD method under a reduced pressure after the transfer.
An apparatus, comprising:
- a first substrate carrier for transferring a substrate in an atmospheric air;
- a second substrate carrier provided almost perpendicular to the first substrate carrier for transferring the substrate in the atmospheric air;
- and
- a processing chamber capable of delivering and receiving the substrate to/from at least one of the first substrate carrier and the second substrate carrier, for processing the substrate under a reduced pressure.
An apparatus, comprising:
- a first substrate carrier for transferring a substrate in an atmospheric air;
- a second substrate carrier for transferring the substrate under a reduced pressure;
- and
- a third substrate carrier for transferring the substrate between the first substrate carrier and the second substrate carrier.
Dependencies are inferred from the claim text.