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US 2001/0043408 A1Published application
Microlithographic illuminating system and microlithographic projection exposure arrangement incorporating said system
AssigneeCarl-Zeiss-Stiftung
InventorsJohannes Wangler, Jess Kohler
Life of this patent
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Abstract
A microlithographic projection exposure arrangement has an off-axis field and has a catoptric or catadioptric projection objective (P). In this arrangement, the illumination system (ILL) is made as small as possible in that a lateral offset (Δy) of the optical axes (OAI, OAP) is introduced relative to each other. A corrective element (AE) is arranged off-axis and functions to adapt the telecentry.
Claims22
A microlithographic illuminating system (ILL) defining an optical axis (OAI) and comprising:
- a light source for supplying and transmitting a light beam (LB) along said optical axis (OAI);
- a plurality of optical elements arranged along said optical axis downstream of said light source for conducting said light beam on a beam path along said optical axis and for defining a field;
- and,
- one of said optical elements (AE) being arranged close to said field for intercepting all of said light beam (LB) and being configured so as to be asymmetrical with respect to said optical axis.
1 more element
A microlithographic projection exposure system comprising:
- an illuminating system (ILL) defining a first optical axis (OAI) and including:
- a light source for supplying and transmitting a light beam (LB) along said first optical axis (OAI);
- a plurality of optical elements arranged along said first optical axis downstream of said light source for conducting said light beam on a beam path along said first optical axis and for defining a field;
- and, one of said optical elements (AE) being arranged close to said field for intercepting all of said light beam (LB) and being configured so as to be asymmetrical with respect to said first optical axis;
- a reticle positioning and moving system (Oret);
- a projection objective (P) downstream of said illuminating system and defining a second optical axis (OAP);
- an object field (OF) decentered with respect to said second optical axis (OAB);
- and,
- a wafer positioning and moving system (OW).
6 more elements
Dependencies are inferred from the claim text.