Vertical ball grid array integrated circuit package
OwnerKlan Teng Eng, Lee Teck Yeowinventors
Life of this patent
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Abstract
An integrated circuit package (30, 32) for vertical attachment as part of a high density module (200) comprising a carrier (70) having an opening (86), routing strips (82), conduits (84) and side surface terminals (100), the side surface terminals (100) disposed on a side surface (92), which side surface is common to the carrier (70) and the integrated circuit package 30, 32. An adhesive layer (60), which attaches a silicon chip (50) to a carrier (70), wire bonding (80) electrically connecting the silicon chip (50) to the routing strips (82) and potting material (90) filling the opening (86), are also disclosed.
Claims27
An integrated circuit package comprising:
- a carrier having a top surface, a side and one or more routing strips being integral with said carrier;
- one or more terminals disposed on a side of said carrier, at least one of said terminals being electrically connected with at least one of said routing strips;
- a chip adhered to said carrier, said chip having one or more bonding pads, wherein said one or more bonding pads are electrically connected to at least one of said routing strips;
- and
- potting material covering at least a portion of said routing strips, wire bonding and bonding pads.
A high density vertical module comprising:
- a horizontal circuit board;
- and
- at least one integrated circuit package having a vertical surface and a side perpendicular to said surface, and having terminals on said side surface that are electrically connected to said circuit board.
A high density double-sided vertical module comprising:
- a circuit board having a top tab and a bottom tab;
- a first integrated circuit package having a side surface terminal, said side surface terminal of said first integrated circuit package being electrically connected to said top tab of said circuit board;
- and
- a second integrated circuit package having a second side surface terminal, said second integrated circuit package being electrically connected to said bottom tab of said circuit board through said second side surface terminal.
A process or providing a high density module produced by a process comprising the steps of:
- obtaining a circuit board having a too;
- and
- electrically connecting at least one integrated circuit package having a side surface terminal, said first integrated circuit package being electrically connected to said top of said circuit board through said side surface terminal of said integrated circuit package.
Dependencies are inferred from the claim text.