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US 2001/0042908 A1Published application
Semiconductor device and manufacturing method of semiconductor device
AssigneeFujitsu Limited
InventorsAkira Okada, Tetsuya Hiraoka, Kazuyuki Aiba
Life of this patent
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Abstract
A substrate of a semiconductor device has a first surface on which a semiconductor element is fixed and a second surface opposite to the first surface. An adhesive is provided between the semiconductor element and the first surface of the substrate. At least one though hole is formed which extends between the first surface and the second surface of the substrate. A pattern member is formed on the first surface of the substrate so as to cover a part of an opening of the through hole.
Claims5
A semiconductor device comprising:
- a semiconductor element;
- a substrate having a first surface on which the semiconductor element is fixed and a second surface opposite to the first surface;
- an adhesive provided between said semiconductor element and said first surface of said substrate;
- at least one though hole extending between said first surface and said second surface of said substrate;
- and
- a pattern member formed on said first surface of said substrate so as to cover a part of an opening of said through hole.
3 more elements
A manufacturing method of a semiconductor device, comprising the steps of:
- forming a pattern member by a metal on a first surface of a substrate;
- fixing a semiconductor element onto the first surface of said substrate;
- and
- irradiate a laser beam onto a position at which said pattern member is formed from a side of a second surface opposite to said first surface of said substrate so as to form a vent hole that penetrates said substrate.
1 more element
Dependencies are inferred from the claim text.