Semiconductor device and process for producing the same

A semiconductor device comprising:

• (1) an insulating tape having a rectangular hole, the hole being defined by a pair of opposed long side ends and a pair of opposed short side ends;
• (2) a rectangular semiconductor chip placed in the hole of the insulating tape,
• the semiconductor chip having a major surface on which an integrated circuit including a plurality of semiconductor elements and a plurality of bonding pads, a pair of opposed long sides and a pair of opposed short sides,
• the plurality of the bonding pads including a plurality of first bonding pads which are connected electrically to the integrated circuit and a plurality of second bonding pads which are not connected electrically to the integrated circuits, the first bonding pads beind disposed along one of the pair of the opposed long sides, and the second bonding pads being disposed along one of the opposed long sides, and the second bonding pads being disposed along the other one of the pair of the opposed long sides;
• (3) a plurality of leads which are formed on the insulating tape,
• the plurality of the leads including a plurality of first leads crossing of the pair of long side ends of the insulating tape and one of the pair of long sides of the semiconductor chip, and extending on the major surface of the semiconductor chip, a plurality of second leads crossing the other one of the pair of long side ends of the insulating tape and the other one of the pair of long sides of the semiconductor chip, and extending on the major surface of the semiconductor chip, and the plurality of third leads crossing a pair of short side ends of the insulating tape and a pair of short sides of the semiconductor chip, and extending on the major surface of the semiconductor chip,
• one ends of the plurality of the first leads being connected to the corresponding first bonding pads, one ends of the plurality of the second leads being connected to the corresponding second bonding pads, and one ends of the plurality of the third leads being not connected to the plurality of the bonding pads;
• and
• (4) an encapsulating resin for covering the major surface of the semiconductor chip, and one ends of the plurality of the first, second and third leads.

A process for producing a semiconductor device, the process compristing the steps of:

• (a) preparing an insulating tape having at least a plurality of leads including dummy leads which are formed on a major surface, and a semiconductor chip having a plurality of bonding pads which are disposed in an uneven manner in a predetermined area on the major surface and dummy bonding pads in an electrically floating state which are disposed in an area different from the area where the bonding pads are disposed;
• (b) placing the semiconductor chip in the device hole of the insulating tape, electrically connecting one end portions of the leads to the corresponding bonding pads and connecting one and portions of the dummy leads to the corresponding dummy bonding pads;
• and
• (c) at least encapsulating the major surface of the semiconductor chip and one end portions of the leads with resin.