Conformal color filter layer above microlens structures in an image sensor die
AssigneeIntel Corporation
InventorNEIL S. WESTER
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Abstract
An embodiment of the invention is a semiconductor die having a number of photodetecting sites that are part of a color image sensor. A number of microlens structures are provided, each positioned above a respective one of the photodetecting sites. A color filter layer is formed above the microlens structures. No passivation layer is formed between the microlens structures and a top metal layer of the die. The die may be used as the eye of an electronic system such as a digital camera.
Claims27
A semiconductor die, comprising:
- a plurality of photodetecting sites;
- a plurality of microlens structures each positioned above a respective one of the photodetecting sites;
- and
- a color filter layer disposed above the microlens structures.
A method of manufacturing, comprising:
- creating a plurality of photodetecting sites that are part of a color image sensor on a semiconductor wafer;
- depositing a passivation layer above the photodetecting sites;
- creating a plurality of microlens structures above the passivation layer, each microlens structure positioned above a respective one of the photodetecting sites to focus incident light onto the respective site;
- and
- creating a color filter layer of multiple colors above the microlens structures.
A method of manufacturing an image sensor die, comprising:
- creating a plurality of microlens structures each positioned above a respective one of a plurality of photodetecting sites in a semiconductor wafer;
- and
- creating a color filter layer of multiple colors above the microlens structures.
An imaging system comprising:
- an image sensor having a plurality of photocells, the photocells providing sensor signals in response to incident light and according to control signals, each photocell having a microlens structure positioned above a photodetecting site and a color filter layer disposed above the microlens structure;
- control circuitry configured to generate the control signals for controlling the image sensor;
- analog to digital conversion unit for digitizing the sensor signals;
- and
- signal processing circuitry for generating image data in response to the digitized sensor signals.
Dependencies are inferred from the claim text.