Semiconductor light emitting device and its manufacturing method

A semiconductor light emitting device comprising:

• a semiconductor light emitting element (1, 1′, 1″);
• a resin stem (10) having a first lead (21), a second lead (22) and a resin portion (10A) partly covering said first and second leads, one end of said first lead and one end of said second lead being externally extended from said resin portion, and said resin portion having a recess containing said semiconductor light emitting element, the other end of said first lead electrically connected to a first electrode of said semiconductor light emitting element, and the other end of said second lead electrically connected to a second electrode of said semiconductor light emitting element;
• a light-transmissive resin (5) filling said recess of said resin stem;
• and
• a projection (9) made of a light-transmissive resin to cover the entire upper surface of said resin stem, said projection being extended down onto side surfaces of said resin stem to a predetermined distance from said upper surface to continuously cover the upper part of the side surfaces all around;
• wherein said recess of said resin stem (10) is longer in a first horizontal direction in which said first and second leads (21, 22) extend than in a second horizontal direction normal to said first horizontal direction.

A semiconductor light emitting device comprising:

• a semiconductor light emitting element (1, 1′, 1″);
• a resin stem (10) having a first lead (21), a second lead (22) and a resin portion (10A) partly covering said first and second leads, one end of said first lead and one end of said second lead being externally extended from said resin portion, and said resin portion having a recess containing said semiconductor light emitting element, the other end of said first lead electrically connected to a first electrode of said semiconductor light emitting element, and the other end of said second lead electrically connected to a second electrode of said semiconductor light emitting element;
• a light-transmissive resin (5) filling said recess of said resin stem;
• and
• a projection (9) made of a light-transmissive resin to cover the entire upper surface of said resin stem, said projection being extended down onto side surfaces of said resin stem to a predetermined distance from said upper surface to continuously cover the upper part of the side surfaces all around;
• wherein inner side surfaces (8) of said recess serve as reflective surfaces.

A method for manufacturing a semiconductor light emitting device comprising the steps of:

• forming a resin stem (10) by integrally molding a lead frame (2) having first and second leads (21, 22) and a resin portion (10A) such that said first and second leads are positioned in an end-to-end alignment in a recess formed in the upper surface of said resin portion;
• mounting a semiconductor light emitting element (1, 1′, 1″) having first and second electrodes in said recess, and electrically connecting said first lead to said first electrode and said second lead to said second electrode;
• injecting a fluid-state thermosetting resin (12) into an encapsulating case mold (11);
• dipping the upper surface of said resin stem and upper parts of side surfaces continuous from the upper surface into said fluid-state resin in said encapsulating case mold;
• and
• hardening said fluid-state resin to form a projection (9) of a light-transmissive resin on said resin stem,
• said projection covering the entire upper surface of said resin stem, and extended down onto side surfaces of said resin stem to a predetermined distance from said upper surface to continuously cover the upper part of the side surfaces all around.

A method for manufacturing a semiconductor light emitting device comprising the steps of:

• forming a resin stem (10) by integrally molding a lead frame (2) having first and second leads (21, 22) and a resin portion (10A) such that said first and second leads are positioned in an end-to-end alignment in a recess formed in the upper surface of said resin portion;
• mounting a semiconductor light emitting element (1, 1′, 1″) having first and second electrodes in said recess, and electrically connecting said first lead to said first electrode and said second lead to said second electrode;
• injecting a first fluid-state thermosetting resin (5) into said recess to embed said semiconductor light emitting element and said first and second leads;
• injecting a second fluid-state thermosetting resin (12) into an encapsulating case mold (11);
• dipping said resin stem into said second fluid-state resin within said encapsulating case mold by bringing said first fluid-state resin into touch with the second fluid-state resin in said encapsulating case mold;
• hardening said first and second fluid-state resins to form a light-transmissive resin encapsulating element (5) in said recess and a projection (9) of a light-transmissive resin on said resin stem,
• said projection covering the entire upper surface of said resin stem, and extended down onto side surfaces of said resin stem to a predetermined distance from said upper surface to continuously cover the upper part of the side surfaces all around.