Electroconductive composition and printed circuit board using the same
AssigneeMurata Manufacturing Co., Ltd.
InventorShuji Matsumoto
Life of this patent
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Abstract
Provided is an electroconductive paste comprising copper powders, a glass powder, and an organic vehicle, wherein: the copper powders comprise (1) from about 50% to 90% by weight of a copper powder A containing from about 1% to 3% by weight of oxygen and having an average particle size of from about 0.9 to 1.5 μm; and (2) from about 10% to 50% by weight of a copper powder B containing from about 0.2% to 3% by weight of oxygen and having an average particle size of not more than about 0.6 μm. It has an excellent electroconductivity as well as a sufficiently large bonding strength to a board.
Claims20
An electroconductive composition comprising copper powder and glass powder,
- wherein said copper powder comprises:
- (a) from about 50% to 90% by weight of a copper powder A containing from about 1% to 3% by weight of oxygen and having an average particle size of from about 0.9 to 1.5 μm;
- and
- (b) from about 10% to 50% by weight of a copper powder B containing from about 0.2% to 3% by weight of oxygen and having an average particle size of not more than about 0.6 μm;
- and
- wherein said glass powder is substantially lead free.
Dependencies are inferred from the claim text.