Method of wire bonding for small clearance
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsRandy H. Y. Lo, Han-Ping Pu, Tony Yuan
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Abstract
A method of wire bonding for small clearance is disclosed. The method employs a conductive bump over the pad of the chip to prevent the capillary from colliding with the chip during the three-dimensional package wiring process The conventional constraint which limits the clearance to greater than 0.2 mm so as to find the appropriate capillary is overcome in this method.
Claims10
A method of wire bonding for small clearance, using a body comprising a plurality of chips, wherein said method is characterized as:
- a conductive bump with an appropriate height is first formed between a pad and a wire during a wiring process for connecting said pad in one side of said body to a lead frame.
A stub structure for wire bonding with small clearance, comprising a body with a plurality of chips, wherein said stub structure is characterized as:
- a conductive bump with an appropriate height is first formed between a pad and a wire during a wiring process for connecting said pad in one side of said body to a lead frame.
Dependencies are inferred from the claim text.