Bump bonding apparatus and method
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsShoriki Narita, Makoto Imanishi, Takaharu Mae, Shinji Kanayama, Nobuhisa Watanabe
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Abstract
Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection.
Claims2
A bump bonding apparatus comprising:
- a bonding head for forming bumps on a wafer having an orientation flat on a circumferential edge thereof;
- a bonding stage for supporting and positioning the wafer such that said bonding head is operable to form bumps on the wafer;
- and
- a transporting device for transporting the wafer to said bonding stage and placing the wafer on said bonding stage in a prearranged orientation, said transporting device including a chucking component operable to hold the wafer at six contact points.
The apparatus of claim 2, wherein said transporting device further includes an orientation flat detection component for detecting a position of the orientation flat of the wafer supported by said bonding stage.
Dependencies are inferred from the claim text.