Bump bonding apparatus and method
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsShoriki Narita, Makoto Imanishi, Takaharu Mae, Shinji Kanayama, Nobuhisa Watanabe
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Abstract
Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection.
Claims7
A bump bonding apparatus comprising:
- a bonding head for forming bumps on a wafer having an orientation flat on a circumferential edge thereof before the wafer is diced into a plurality of individual IC chips;
- a bonding stage for supporting and positioning the wafer such that said bonding head is operable to form bumps on the wafer;
- and
- a transporting device for transporting the wafer to said bonding stage and placing the wafer on said bonding stage in a prearranged orientation, said transporting device including an integral orientation flat detection component for detecting a position of the orientation flat of the wafer supported by said bonding stage.
A bump bonding apparatus comprising:
- a loading station including a carrier for storing a plurality of wafers in a stack formation so as to have a defined gap between each of the wafers, each of the wafers having an orientation flat on a circumferential edge thereof, said loading station further including a lifter for positioning said carrier at a vertical position, an integral orientation flat detecting device for detecting whether the orientation flat of a wafer in said carrier is in a specified reference position range, and an indicating device for notifying an operator when said detecting device detects the orientation flat of the wafer to be outside the specified reference position range;
- an extraction device for removing one of the wafers from said carrier;
- a bonding stage for supporting and positioning the removed wafer;
- a transporting device for transporting the removed wafer to said bonding stage and placing the wafer on said bonding stage;
- and
- a bonding head for forming bumps on the wafer removed by the extraction device and supported on said bonding stage before the wafer is diced into a plurality of individual IC chips.
Dependencies are inferred from the claim text.