US 2001/0042733 A1 · Process for manufacturing a multi-layer circuit board

Abstract

A circuit board having a structure including a permanent photoimageable dielectric material suitable for fabrication of vias both by laser ablation, plasma ablation, or mechanical drilling techniques and by photoimaging techniques. A process is also disclosed for the manufacture of a multi-level circuit on a substrate having a first-level circuitry pattern on at least one side. The process comprises applying a permanent photoimageable dielectric over the first-level circuitry pattern; exposing the permanent photoimageable dielectric to radiation; laminating a conductive metal layer to the dielectric; making holes in the conductive metal layer and dielectric by mechanical drilling or by laser or plasma ablation; and making a second-level circuitry pattern and filling the holes with a conductive material to electrically connect the first and second layers of circuitry. A further process is claimed for designing a multi-level circuit board product comprising making a prototype having the above structure in which the holes are manufactured by mechanical drilling or by laser or plasma ablation, evaluating the prototype, and then manufacturing a commercial circuit board having essentially the same structure and materials of construction as the prototype, but wherein the holes are manufactured by photoimaging techniques.

Claims21

Dependent claims

A process for manufacture of a circuit board on a substrate having a top side and a bottom side and a first-level circuitry pattern on at least one of said sides, the process comprising the steps of:

a) applying a permanent photoimageable dielectric material over said first-level circuitry pattern;
b) exposing said permanent photoimageable dielectric material to radiation;
c) laminating a layer of conductive metal to said dielectric material;
d) making holes in said layer of conductive metal to uncover portions of said dielectric material and in said dielectric material to uncover portions of said first-level circuitry pattern, said holes made by a method selected from the group consisting of mechanical drilling, laser ablation, and plasma ablation;
and
e) making a second-level circuitry pattern on said dielectric material including placing conductive material in said holes to electrically connect said second layer circuitry pattern and said first layer circuitry pattern.

3 more elements

A process for developing a commercial multi-layer circuit board product comprising the steps of:

a) making a prototype multi-layer circuit board having a structure comprising a substrate having a top side and a bottom side, a first-level circuitry pattern on at least one of said sides, a permanent photoimageable dielectric material over said first-level circuitry pattern, a conductive metal layer having a second-level circuitry pattern over the dielectric material, and a plurality of vias in said dielectric material containing conductive material that electrically connects said second-level circuitry pattern with said first-level circuitry pattern, wherein making said prototype multi-layer circuit board includes fabricating said vias by a method selected from the group consisting of laser ablation, plasma ablation, and mechanical drilling;
b) evaluating said prototype;
and
c) making the commercial multi-layer circuit board having a structure and materials of construction identical to said prototype multi-layer circuit board, but wherein making said commercial multi-layer circuit board includes fabricating said vias by a photoimaging technique.

1 more element

Dependencies are inferred from the claim text.

Process for manufacturing a multi-layer circuit board

Life of this patent

Process for manufacturing a multi-layer circuit board

Life of this patent

Abstract

Claims21