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AssigneeInternational Rectifier Corporation
InventorLawrence Kulinsky
Estimating the term…
A novel five-layer tape is provided for applications such as bonding, interconnection and insulation of different parts of a semiconductor package at the same time. The five layer tape includes a metal conductive layer that is sandwiched between two insulative layers, that are themselves in turn sandwiched by two adhesive layers. Windows cut into the insulative and adhesive layers on either the top or bottom of the tape permit electrical connection to the metallic conductive layer. The tape may be made from two insulation sheets that have an adhesive layer and a metallic interconnect. In turn, the tape enables the manufacturer to overcome physical limitations in forming conduction paths, including permitting the connection of multiple die where the terminals of the one die are obscured by the other die.
A multiple layer tape comprising:
An interconnection between a five layer tape and a semiconductor bonding pad site comprising
A method for making a multiple layer tape for use in semiconductor device formation, the method comprising:
A die-on-die bonded package comprising the following:
A co-packed system of a plurality of power transistor dies mounted on a single lead frame comprising:
Dependencies are inferred from the claim text.