Dilute cleaning composition and method for using same
AssigneeMicron Technology, Inc.
InventorsMAX HINEMAN, GUY T. BLALOCK
Life of this patent
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Abstract
A dilute composition for use in semiconductor processing includes both phosphoric acid and acetic acid. Each of the acidic components may be at a concentration of less than about 10% by volume of the dilute composition. The dilute composition can be used for cleaning various surfaces, such as, for example, patterned metal layers and vias by exposing the surfaces to the dilute composition.
Claims47
A cleaning method in a semiconductor fabrication process, comprising the steps of:
- providing a dilute composition comprising phosphoric acid and acetic acid;
- and
- exposing a surface to the dilute composition.
A cleaning method in a semiconductor fabrication process, comprising the steps of:
- providing a dilute composition consisting essentially of phosphoric acid and acetic acid;
- and
- exposing a surface to the composition.
A method of fabricating an interconnect structure, comprising the steps of:
- patterning a conducting layer;
- and
- cleaning the conducting layer using a dilute composition comprising phosphoric acid and acetic acid.
A method of fabricating a multilevel interconnect structure, comprising the steps of:
- providing an insulating layer over a first metal layer;
- defining a via in the insulating layer, resulting in residue on an exposed portion of the first metal layer;
- and
- removing the residue using a dilute composition of phosphoric acid and acetic acid.
A method of fabricating a multilevel interconnect structure, comprising the steps of:
- patterning a first metal layer over a contact hole using a photoresist and etchant;
- forming an insulating layer over the first metal layer;
- defining a via in the insulating layer over the first metal layer, resulting in organic residue on at least a portion of the via;
- and
- removing the organic residue on the via using a dilute composition of phosphoric acid and acetic acid.
A cleaning composition for use in semiconductor integrated circuit fabrication, the cleaning composition consisting essentially of an aqueous solution including phosphoric acid and acetic acid.
A cleaning composition for use in semiconductor integrated circuit fabrication, comprising an aqueous solution including phosphoric acid at a concentration of less than about 10% by volume and acetic acid at a concentration of less than about 10% by volume.
Dependencies are inferred from the claim text.