Tin contact barc for tungsten polished contacts

A method for fabricating interconnecting lines and vias in a layer of insulating material comprising the steps of:

• providing a substrate having an insulating layer;
• forming a titanium nitride antireflective layer over the insulating layer;
• providing a thin photoresist layer over the titanium nitride antireflective layer;
• developing the thin photoresist layer exposing portions of the antireflective layer;
• etching the exposed portions of the titanium nitride antireflective layer exposing portions of the insulating layer;
• etching exposed portions of the insulating layer to form a via;
• stripping off the photoresist layer;
• filling the via with a barrier material layer, the barrier material covering the antireflective layer;
• filling the via with tungsten material layer, the tungsten material layer covering the barrier material layer;
• and
• polishing back the tungsten material layer, the barrier material layer and the antireflective layer using a tungsten polish.

A method for fabricating interconnecting lines and vias in a layer of insulating material comprising the steps of:

• providing a substrate having an insulating layer;
• forming a titanium nitride antireflective layer over the insulating layer;
• providing a thin photoresist layer over the titanium nitride antireflective layer;
• developing the thin photoresist layer exposing portions of the antireflective layer;
• etching the exposed portions of the titanium nitride antireflective layer exposing portions of the insulating layer using a MERIE method with reactant gases of CL2 (30-200 sccm) and BCL3 (10-200 sccm) at a power level within the range of about 300-800 W, and pressure within the range of about 60-400 mT;
• etching exposed portions of the insulating layer to form a via;
• stripping off the photoresist layer;
• filling the via with a barrier material layer, the barrier material covering the antireflective layer;
• filling the via with tungsten material layer, the tungsten material layer covering the barrier material layer;
• polishing back the tungsten material layer and the barrier material layer;
• and
• forming a second metal layer over the antireflective layer.