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US 2001/0041389 A1Published application
Smiconductor device having a thermoset- containing dielectric material and methods for fabricating the same
AssigneeInternational Business Machines Corporation
InventorsDonald S. Farquhar, Konstantinos I. Papathomas, Mark D Poliks
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Abstract
A semiconductor device having a thermoset-containing, dielectric material and methods for fabricating the same is provided. The device may take the form of a printed circuit board, an integrated circuit chip carrier, or the like. The dielectric material is a non-fibrillated, fluoropolymer matrix that has inorganic particles distributed therein and is impregnated with a thermoset material.
Claims45
In combination:
- a fluoropolymer matrix having particles distributed therein;
- and
- a thermosetting resin.
A device, comprising:
- a conductive layer;
- a polytetrafluoroethylene matrix, containing particles therein, overlaying the conductive layer;
- and
- a thermosetting resin, for bonding the conductive layer to the polytetrafluoroethylene matrix.
1 more element
A method for forming a device, comprising the following steps:
- providing a fluoropolymer matrix having particles therein;
- providing a thermosetting resin;
- and
- laminating the fluoropolymer matrix to a conductor using the thermosetting resin.
1 more element
A method for forming a device, comprising the following steps:
- providing a fluoropolymer matrix having particles therein;
- coating the fluoropolymer matrix with a thermosetting resin;
- and
- laminating the coated fluoropolymer matrix to a conductor.
1 more element
Dependencies are inferred from the claim text.