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US 2001/0041385 A1Published application
Plated leadframes with cantilevered leads
AssigneeSTMicroelectronics S.r.I.
InventorsAndrea Giovanni Cigada, Fulvio Silvio Tondelli
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AssigneeSTMicroelectronics S.r.I.
InventorsAndrea Giovanni Cigada, Fulvio Silvio Tondelli
Estimating the term…
A metal frame patterned by die stamping has the outermost end portion of each patterned pin extending freely, without constraints, from a line of metal bridge connections (dam bar). The end face of each pin is also covered, as well as other surfaces of the frame, by a coating layer or multilayer of metals different from the metal of the die stamped frame. The coating layer or multilayer contains at least on its outer surface, a noble metal such as palladium or gold. The tip of the pins are not subject to cutting and/or trimming after plating the die stamped frame. The pins are not even cut or trimmed during separation of the patterned frame from the surrounding metal at the end of the encapsulation process, when the pins are then eventually bent into shape.
A metal frame for assembling integrated devices for surface mounting on a printed circuit card constituted of a metal plate patterned by die stamping a metal strip and coated after stamping with one or more metal and/or metal alloy layers, at least the top coating layer of which contains a noble metal, the stamping patterning several frames along said strip, each having an array of pins, the outermost portion of which extends from a line (dam bar) of metal bridge connections upon which abuts the edges of encapsulation mold during the assembling of the integrated device,
Dependencies are inferred from the claim text.