Method of producing semiconductor device and configuration thereof, and lead frame used in said method
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsKenji Ohgiyama, Teruhisa Fujihara, Tamotsu Ueda
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Abstract
Providing a method of producing a semiconductor device wherein semiconductor element are sealed with a resin by using the same lead and other means regardless of the specifications of the semiconductor elements, and a semiconductor device which can be reduced in size and weight and has good heat dissipation performance and high-frequency performance. The semiconductor devices can be produced by mounting a plurality of the semiconductor elements on the lead frame having leads disposed substantially parallel to each other, sealing the whole with a resin, and cutting off the individual semiconductor devices.
Claims18
A method of producing a semiconductor device comprising a die bond pad, a wire bond pad, a semiconductor element mounted on the die bond pad, and a sealing resin for molding the semiconductor element, which comprises preparing a lead frame having a plurality of leads disposed substantially in parallel to each other at intervals in the longitudinal direction in the same plane;
- bonding a plurality of semiconductor elements in parallel on at least one lead surface of the lead frame;
- electrically connecting an electrode of each semiconductor element and another lead adjacent therewith in the longitudinal direction;
- molding the plurality of semiconductor elements together by means of the sealing resin applied from above the lead surface so that the back side of the lead is exposed;
- and cutting the lead and the sealing resin in the longitudinal direction between the semiconductor elements, thereby to take the lead with the semiconductor element being mounted thereon as a die bond pad, and to take the lead connected to the electrode of the semiconductor element as a wire bond pad.
A semiconductor device comprising a die bond pad with a semiconductor element mounted on the top surface thereof;
- a wire bond pad arranged substantially in parallel to each other in the longitudinal direction while interposing the die bond pads therebetween;
- and a sealing resin for molding the semiconductor elements;
- wherein the sealing resin is applied from above the die bond pads and the wire bond pads so that the back surfaces of the die bond pads and the wire bond pads are exposed, while the space between the die bond pads and the wire bond pads is also filled with the sealing resin.
Dependencies are inferred from the claim text.