Resin encapsulated electrode structure of a semiconductor device, mounted semiconductor devices, and semiconductor wafer including multiple electrode structures

A method of producing a semiconductor integrated circuit package including hardened packaging resin and a polished electrode on said wafer, comprising:

• producing external leading out electrodes on a wafer including an IC chip employing photolithography in a wafer process for producing an IC chip;
• plating resin on the wafer in the wafer state and hardening said resin;
• polishing the surface of said the wafer thereby to clean said external leading out electrodes;
• and
• performing dicing/slicing/cutting to said wafer and expanding said wafer, thereby producing a flip-chip type package.

A method of producing a semiconductor integrated circuit package including hardened packaging resin and a polished electrode on said wafer, comprising:

• producing external leading out electrodes employing photolithography in a wafer process for producing an IC chip on a wafer including an IC chip;
• plating resin on the wafer in the wafer state and hardening said resin;
• polishing the surface of said wafer thereby to clean said external leading out electrodes;
• performing dicing/slicing/cutting to said wafer and expanding said wafer;
• after the expanding, provisionally mounting said flip-chip type package onto a burn-in substrate by performing soldering;
• performing a burn-in test to said flip-chip type package in said provisionally mounted state;
• heating and melting said soldered portion and taking out said flip-chip type package from said burn-in substrate;
• and
• mounting said flip-chip type package onto a printed circuit board utilizing said external leading out electrode.

A method for producing a multi-chip module including a plurality of semiconductor integrated circuit packages which are produced by the steps of producing external leading out electrodes on a wafer including an IC chip employing photolithography in a wafer process for producing an IC chip;

• plating resin on the wafer in the wafer state and hardening said resin;
• polishing the surface of said wafer thereby to clean said external leading out electrodes;
• and performing dicing/slicing/cutting to said wafer and expanding said wafer, which comprises:
• obtaining-plural kinds of flip-chip type IC packages which are produced by the steps of producing external leading out electrodes on a wafer including an IC chip employing photolithography in a wafer process for producing an IC chip;
• plating resin on the wafer in the wafer state and hardening said resin;
• polishing the surface of said wafer thereby to clean said external leading out electrodes;
• and performing dicing/slicing/cutting to said wafer and expanding said wafer;
• mounting plural kinds of flip-chip type IC packages on a printed circuit board by soldering;
• and
• performing a multi-chip system test with repeating replacement of faulty chips.

A method for mounting a semiconductor integrated circuit having a protective package produced by the steps of producing external leading out electrodes on a wafer including an IC chip employing photolithography in a wafer process for producing an IC chip;

• plating resin on the wafer in the wafer state and hardening said resin;
• polishing the surface of said wafer thereby to clean said external leading out electrodes;
• and performing dicing/slicing/cutting to said wafer and expanding said wafer, comprising:
• soldering said semiconductor integrated circuit package on a printed circuit board;
• and
• fixing radiative fins by heat conductive grease onto a rear surface opposite to a front surface of said semiconductor integrated circuit having said protective package, which front surface has electrodes.