Method for forming a micromechanical device

A method for forming a micromirror, comprising:

• providing a substrate;
• providing a sacrificial layer on the substrate;
• providing one or more layers for a movable element and hinge;
• providing a metal layer after providing the one or more layers;
• patterning the one or more layers and metal layer to define a conductive and reflective hinged movable element on the substrate;
• and
• removing the sacrificial layer.

A method for forming a spatial light modulator, comprising:

• providing a sacrificial layer on a substrate;
• providing one or more layers for a movable element and hinge at a temperature greater than 400 degrees Celsius;
• and
• providing a metal layer after providing the one or more layers;

A method for forming a spatial light modulator in a CMOS foundry, comprising:

• providing a CMOS foundry to make the spatial light modulator;
• providing a substrate wafer into the CMOS assembly line;
• providing a sacrificial layer comprising silicon;
• providing one or more high temperature insulating layers;
• providing a metal layer after the insulating layer or layers;
• and removing the sacrificial layer;
• wherein the CMOS foundry rules that high temperature insulating
• layers are provided prior to providing metal, are followed.

A projection system, comprising:

• a light source;
• a color wheel or prism for providing sequential color;
• a spatial light modulator, comprising
• an array of pixels, each pixel comprising at least one deflectable element with one or more flexible portions that undergo deformation upon the application of an actuation force;
• each deflectable element comprising a first structural layer and a second structural layer formed after and on top of the first structural layer;
• wherein the one or more flexible portions are formed in the second layer and not the first layer;
• and projection optics for projecting light from the light source that passes via the color wheel or prism and is reflected from the spatial light modulator.