Semiconductor device and manufacturing method thereof
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorShunpei Yamazaki
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Abstract
Technology for manufacturing a high performance electric device using a plastic support (including a plastic film and a plastic substrate) is provided. The present invention is characterized in that, after necessary elements for a light emitting device are formed on a substrate having better heat resistance than plastic with a separating layer and an underlayer film interposed therebetween, the elements and the underlayer film are moved from the substrate having better heat resistance onto a plastic support having color filters thereon by a process at room temperature. The color filters are attached to the underlayer film of the elements using an adhesive layer.
Claims36
A semiconductor device comprising:
- an adhesive layer on a substrate;
- an insulating film on said adhesive layer;
- and
- light emitting elements on said insulating film,
- wherein emitted from said light emitting elements is emitted through said substrate.
A semiconductor device comprising:
- a first substrate comprising an organic material and having TFTs provided thereon;
- a second substrate;
- and
- a liquid crystal material retained between said first and second substrates,
- wherein color filters are provided between said first substrate and said TFTs.
A semiconductor device comprising:
- color filters are provided on a substrate;
- an adhesive layer over said substrate and said color filters;
- an insulating film on said adhesive layer;
- and
- light emitting elements on said insulating film,
- wherein emitted from said light emitting elements is emitted through said substrate, and
- wherein said substrate is a plastic substrate comprising an organic material.
A method of manufacturing a semiconductor device comprising the steps of:
- forming a separating layer on a first substrate;
- forming an insulating film on said separating layer;
- forming light emitting elements on said insulating film;
- attaching a fixing substrate on said light emitting elements using a first adhesive layer;
- removing said separating layer by exposing said separating layer to gas containing halogen fluoride to separate said first substrate;
- and
- attaching a second substrate to said insulating film using a second adhesive layer,
- wherein said second substrate has color filters provided thereon.
A method of manufacturing a semiconductor device comprising the steps of:
- forming a separating layer on a first substrate;
- forming an insulating film on said separating layer;
- forming an active layer, a gate insulating film, and gate electrodes on said insulating film;
- forming a first interlayer insulating film so as to cover said gate electrodes;
- forming wiring and pixel electrodes on said first interlayer insulating film;
- attaching a fixing substrate provided with an opposing electrode on said first substrate using a sealant;
- injecting liquid crystal between said pixel electrodes and said opposing electrode;
- removing said separating layer by exposing said separating layer to gas containing halogen fluoride to separate said first substrate;
- and
- attaching a second substrate to said insulating film using an adhesive layer,
- wherein said second substrate has color filters provided thereon.
Dependencies are inferred from the claim text.