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US 2001/0040644 A1Published application
Bonded layer semiconductor device
AssigneeKopin Corporation
InventorsDUY-PHACH VU, BRENDA D. DINGLE, JASON E. DINGLE, NGWE CHEONG
Life of this patent
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Abstract
The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body. TFT's activate display electrodes formed adjacent the transistors after the tiles have been transferred.
Claims6
A method of fabricating a plurality of active matrix liquid crystal displays comprising:
- forming a silicon layer over an insulating layer and a supporting substrate;
- forming a plurality of arrays of transistors with the silicon layer to form a plurality of active matrix display circuits on the substrate;
- forming an array of pixel electrodes with a polycrystalline silicon material for each array of transistors;
- positioning a liquid crystal material between each array of pixel electrodes;
- and
- separating regions of the silicon layer to form a plurality of displays.
3 more elements
A method of fabricating a plurality of active matrix liquid crystal displays comprising;
- forming a silicon layer over an insulating layer and a supporting substrate;
- forming a plurality of arrays of transistors with the silicon layer to form a plurality of active matrix display circuits on the substrate;
- forming an array of pixel electrodes with a polycrystalline silicon material for each array of transistors;
- positioning a liquid crystal material between each array of pixel electrodes;
- transferring the array of pixel electrodes to an optically transmissive substrate;
- and
- separating regions of the silicon layer to form a plurality of displays.
4 more elements
A method of fabricating a plurality of active matrix liquid crystal displays comprising;
- forming a silicon layer over an insulating layer and a supporting substrate;
- forming a plurality of arrays of transistors with the silicon layer to form a plurality of active matrix display circuits on the substrate;
- forming an array of pixel electrodes with a polycrystalline silicon material for each array of transistors;
- positioning a liquid crystal material between each array of pixel electrodes;
- transferring the array of pixel electrodes to an optically transmissive substrate;
- positioning a light shield between the transistors of the optically transmissive substrate;
- and
- separating regions of the silicon layer to form a plurality of displays.
5 more elements
Dependencies are inferred from the claim text.