Electric contact device for testing semiconductor device
OwnerMichinobu Tanioka, Hiroshi Matsuokainventors
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Abstract
An electric contact device for testing a semiconductor device including pads or bumps including: a contacting sheet having bumps or pads at positions corresponding to the pads or the bumps of the semiconductor device overlying the testing substrate; and an elastic conductive sheet for generating contact between the semiconductor device and the contact sheet. Damage of external terminals of the semiconductor device can be minimized to delete a harmful influence on the next step.
Claims16
An electric contact device for use in a testing apparatus for testing a semiconductor device having a plurality of external terminals thereon, said electric contact device comprising a contact sheet having a top surface mounting thereon a plurality of first test terminals to be in contact with the external terminals and a bottom surface mounting thereon a plurality of second test terminals and electrically connected to respective said first test terminals, and an elastic conductive sheet having a top surface mounting thereon a plurality of third terminals in contact with respective said second terminals and a bottom surface mounting thereon a plurality of fourth terminals electrically connected to respective said third terminals.
An electric contact device for use in a test apparatus for testing a semiconductor device including pads as external terminals comprising:
- a testing substrate to be in contact with the semiconductor device;
- a metal wire embedded sheet including an elastic material and metal wires embedded therein of which a top end is exposed;
- and
- a plurality of bumps positioned on the top ends of the metal wires opposite to the external terminals of the semiconductor device.
Dependencies are inferred from the claim text.