Method of making a high density integral test probe

A structure comprising:

• a substrate having a surface;
• a plurality of electrically conductive members disposed on said surface;
• said electrically conductive members have an enlarged base, an elongated electrically conductive member in contact with said base and extending away from said base;
• a sheet of material having a plurality of openings disposed for alignment with said plurality of electrically conductive members;
• said sheet is disposed over said plurality of electrically conductive members with said elongated electrically conductive member extending through said plurality of openings.

A structure comprising:

• a substrate having a surface;
• a plurality of electrically conductive members disposed on said surface;
• said electrically conductive members have an elongated base, an elongated electrically conductive member in contact with said base and having an end extending away from said base;
• said end being enlarged.

A method comprising the steps of:

• providing a substrate having a surface;
• bonding an elongated electrical conductor to said surface by forming a ball bond at said surface;
• shearing said elongated conductor from said ball bond leaving an exposed end of said elongated conductor;
• flattening said exposed end.

An apparatus for making electrical contact with a plurality of solder balls on an integrated circuit device comprising:

• first fan out substrate having a first surface;
• said first surface having a plurality of contact locations;
• a plurality of ball bonds attached to said plurality of contact locations;
• a plurality or short studs extending outward from said ball bonds, away from said first surface on fan out substrate.