Plasma display panel with driving circuit one sidedly and its manufacturing method

A method for manufacturing a plasma display panel (PDP), said PDP having a first substrate and a second substrate spaced apart from said first substrate, said first substrate having a first length and said second substrate having a second length, said second length being longer than said first length, said method comprising steps of:

• (a) forming a first electrode on said first substrate along a first direction;
• (b) forming a bonding electrode on a first edge of said first substrate uncovered by said second substrate, and forming a first conductive pad on said bonding electrode;
• (c) forming a second electrode on said second substrate along a second direction, and forming a second conductive pad on a first end of said second electrode, said second direction being substantially perpendicular to said first direction;
• (d) connecting said first conductive pad with said second conductive pad, and bonding said first and said second substrates so that said second electrode of said second substrate is electrically connected to said bonding electrode of said first substrate;
• and
• (e) forming a sealing frit around said first substrate for sealing said first substrate and said second substrate.

A method for manufacturing a plasma display panel (PDP), said PDP having a first substrate and a second substrate spaced apart from said first substrate, said first substrate having a first length and said second substrate having a second length, said second length being longer than said first length, said method comprising steps of:

• (a) forming a first electrode on said first substrate along a first direction;
• (b) forming a bonding electrode on a first edge of said first substrate uncovered by said second substrate, and forming a first conductive pad on said bonding electrode;
• (c) forming a second electrode on said second substrate along a second direction, and forming a second conductive pad on a first end of said second electrode, said second direction being substantially perpendicular to said first direction;
• (d) forming a sealing frit between said first electrode and said bonding electrode for sealing said first substrate and said second substrate;
• and
• (e) connecting said first conductive pad with said second conductive pad, and bonding said first substrate and said second substrate so that said second electrode of said second substrate is electrically connected to said bonding electrode of said first substrate.

A plasma display panel (PDP) connected with an outer circuit, said PDP comprising:

• a first substrate having a upper surface, said upper surface including a covered region and an exposed region, said exposed region having a first edge;
• a second substrate having a lower surface and a second edge, said second substrate being positioned above said covered region of said first substrate, said lower surface of said second substrate being faced said upper surface of said first substrate, and said exposed region of said first substrate being protruded from said second edge of said second substrate;
• a signal electrode disposed on said lower surface and extended to said second edge of said second substrate;
• a bonding electrode disposed on said upper surface of said first substrate, said bonding electrode extending from said covered region to said exposed region, and said bonding electrode above said exposed region connecting to said outer circuit;
• a first conductive pad protruded from said upper surface of said first substrate and electrically connected with said bonding electrode;
• and
• a second conductive pad protruded from said lower surface of said second substrate to contact with said first conductive pad and electrically connected with said signal electrode,
• wherein said bonding electrode is electrically connected with said outer circuit and said signal electrode is electrically connected with said bonding electrode through said first and said second conductive pads so that said signal electrode is electrically connected to said outer circuit.

A method for manufacturing a plasma display panel (PDP), said PDP being connected to an outer circuit, said PDP having a first substrate and a second substrate, said first substrate having a upper surface and said second substrate having a lower surface, said tipper surface having a covered region and an exposed region, said exposed region having a first edge and said second substrate having a second edge, said method comprising steps of:

• (a) forming a bonding electrode on said first substrate and forming a first conductive pad protruded from said bonding electrode, said bonding electrode being extended from said covered region to said exposed region;
• (b) forming a signal electrode and a second conductive pad on said second substrate, said signal electrode being extended to said second edge of said second substrate, and said second conductive pad being protruded from said signal electrode;
• and
• (c) disposing said second substrate on said covered region of said first substrate in order to make said exposed region of said first substrate exposed from said second edge of said second substrate, and connecting said first conductive pad and said second conductive pad for allowing said signal electrode on said second substrate connecting with said bonding electrode on said first substrate so that said bonding electrode on said exposed region being connected to said outer circuit.

A method for manufacturing a plasma display panel (PDP) method, said PDP having a first substrate and a second substrate, said first substrate having a upper surface and said second substrate having a lower surface, said upper surface having a covered region and an exposed region, said exposed region having a first edge and said second substrate having a second edge, said method comprising steps of:

• (a) forming a bonding electrode, a first conductive pad, and a sealing frit on said upper surface of said first substrate, said bonding electrode being extended from said covered region to said exposed region of said first substrate, said first conductive pad protruded from said bonding electrode, and said sealing frit protruded from said covered region of said first substrate;
• (b) forming a signal electrode and a second conductive pad, said signal electrode being extended to said second edge of said second substrate and said second conductive pad protruded from said signal electrode;
• (c) disposing said second substrate on said covered region of said first substrate in order to make said exposed region of said first substrate exposed from said second edge of said second substrate, and connecting said first conductive pad and said second conductive pad for allowing said signal electrode on said second substrate connecting with said bonding electrode on said first substrate so that said bonding electrode on said exposed region be connected with said outer circuit;
• and
• (d) connecting said sealing frit with said lower surface of said second substrate for sealing said first and said second substrates to from said PDP.