Apparatus and method for vacuum encapsulation of semiconductor chip packages

Apparatus for vacuum encapsulation of a semiconductor chip package, comprising:

• a dispense chamber having an inlet end, an outlet end and a material dispenser mounted therein operable to dispense encapsulant material about peripheral edges of a semiconductor chip package during a dispense cycle;
• an inlet chamber mounted adjacent the inlet end of said dispense chamber and isolatable therefrom, said inlet chamber including a transport mechanism operable to transfer a semiconductor chip package to said dispense chamber;
• an outlet chamber mounted adjacent the outlet end of said dispense chamber and isolatable therefrom, said outlet chamber including a transport mechanism operable to receive a semiconductor chip package onto which encapsulant material has been dispensed from said dispense chamber;
• at least one vacuum pump fluidly connected to said inlet, outlet and dispense chambers for evacuating each of said chambers in a controlled manner, whereby said dispense station is evacuated, said inlet chamber is evacuated prior to the transfer of a semiconductor chip package to said dispense chamber, and said outlet chamber is evacuated prior to the receipt of a semiconductor chip package onto which encapsulant material has been dispensed from said dispense chamber;
• and
• a vent connected to said outlet chamber for venting said outlet chamber to atmosphere, whereby upon venting said outlet chamber to atmosphere, the dispensed encapsulant material is forced into the semiconductor chip package to form an encapsulation layer therein.

A method of encapsulating a semiconductor chip package, comprising:

• evacuating a first chamber;
• placing a semiconductor chip package into a second chamber at atmosphere;
• evacuating the second chamber and moving the semiconductor chip package to the evacuated first chamber;
• dispensing encapsulant material about peripheral edges of the semiconductor chip package in the evacuated first chamber;
• evacuating a third chamber;
• transporting the encapsulated semiconductor package from the first chamber into the evacuated third chamber;
• and
• venting the third chamber to atmosphere to force the encapsulant material into the semiconductor chip package.

A method of encapsulating a semiconductor chip package, comprising:

• providing a first chamber having inlet and outlet ends;
• mounting a second chamber adjacent the inlet end of the first chamber;
• providing a movable partition between the first and second chambers for providing a substantially air-tight seal between the first and second chambers;
• mounting a third chamber adjacent the outlet end of the first chamber;
• providing a movable partition between the first and third chambers for providing a substantially air-tight seal between the first and third chambers;
• closing the movable partitions between the first and second chambers and the first and third chambers;
• evacuating the first chamber;
• placing a semiconductor chip package into a second chamber at atmosphere;
• evacuating the second chamber and moving the semiconductor chip package into the evacuated first chamber;
• dispensing encapsulant material about peripheral edges of the semiconductor chip package in the evacuated first chamber;
• evacuating the third chamber;
• transporting the semiconductor package from the evacuated first chamber into the evacuated third chamber about which encapsulant material has been dispensed;
• and
• venting the evacuated third chamber to atmosphere to force the encapsulant material into the semiconductor chip package.