Flip chip adaptor package for bare die
AssigneeMicron Technology, Inc.
InventorWalter L. Moden
Life of this patent
Estimating the term…
Abstract
A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circuit board including first elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the board and the master board, and second elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the semiconductor die and the board. The board has circuit traces for electrical communication between the board/master board electrical contact elements, and the semiconductor die board electrical contact elements.
Claims114
A substrate having a plurality of circuits thereon for connecting a bare semiconductor die having a plurality of bond pads on a portion of a surface thereof to another substrate, said substrate using a plurality of bond wires to connect the plurality of bond pads on said bare semiconductor die and the plurality of circuits on said substrate, comprising:
- a substrate including at least a portion of a printed circuit board having a first die side surface for attaching a portion of the surface having a plurality of bond pads of said bare semiconductor die thereto, a second attachment surface having a plurality of bond pads located thereon for connecting said plurality of bond wires thereto, at least one via extending therethrough for having a portion of said plurality of bond wires extending therethrough, and a plurality of circuit traces for connecting to said bond wires for connecting to said plurality of bond pads of said bare semiconductor die and for electrically connecting between said bare semiconductor die and said another substrate;
- and
- at least a portion of a plurality of electrical connectors located on the second attachment surface of the substrate for electrically connecting said substrate and said another substrate, the at least a portion of a plurality of electrical connectors for connecting to the plurality of circuit traces.
A substrate having a plurality of circuits for connecting one or more bare semiconductor die to another substrate, each bare semiconductor die of the one or more bare semiconductor die having a plurality of bond pads on a portion of a surface thereof and for connecting to said another substrate, said substrate using a plurality of bond wires for connecting between the plurality of bond pads on said each bare semiconductor die of said one or more bare semiconductor die and said plurality of circuits on said substrate, comprising:
- a multilayer substrate having a first die side surface for attaching thereto of a portion of the surface having a plurality of bond pads of said one or more bare semiconductor die, a second attachment surface having a plurality of bond pads located thereon for connecting said plurality of bond wires thereto, one or more vias extending therethrough for said plurality of bond wires to extend therethrough from said plurality of bond pads of said one or more bare semiconductor die, and a plurality of circuit traces for connecting said plurality of bond wires connected to said plurality of bond pads of said one or more bare semiconductor die and for electrically connecting between said one or more bare semiconductor die and said another substrate;
- and
- a plurality of electrical connectors located on the second attachment surface of the substrate for electrically connecting said substrate and said another substrate, the plurality of electrical connectors connected to the plurality of circuit traces.
A substrate having a plurality of circuits thereon for connecting a plurality of bare semiconductor die to another substrate, each bare semiconductor of said plurality of bare semiconductor die having a plurality of bond pads on a portion of a surface thereof for connecting to said another substrate, said substrate using a plurality of bond wires for connecting between the plurality of bond pads on said plurality of bare semiconductor die and a plurality of circuits on said substrate, comprising:
- a substrate having at least one layer, having a first die side surface for attaching thereto a portion of the surface having a plurality of bond pads of said plurality of bare semiconductor die, a second attachment surface having a plurality of bond pads located thereon for connecting of said plurality of bond wires thereto, a plurality of vias extending therethrough for said plurality of bond wires to extend therethrough from said plurality of bond pads of said plurality of bare semiconductor die, and a plurality of circuit traces for connection to said plurality of bond wires connected to said plurality of bond pads of said plurality of bare semiconductor die and for electrically connecting between said plurality of bare semiconductor die and said another substrate;
- and
- a plurality of electrical connectors located on the second attachment surface of the substrate for electrically connecting said substrate and said another substrate, the plurality of electrical connectors for connecting to the plurality of circuit traces.
An electrical assembly for connection to a substrate having a plurality of circuits comprising:
- a bare semiconductor die having a surface having a plurality of bond pads located thereon;
- a substrate having a die side surface, an attachment surface, a via extending through the die substrate from the die side surface to the attachment surface, and a plurality of circuit traces, a portion of the surface having the plurality of bond pads of said bare semiconductor die attached to a portion of the die side surface of the substrate;
- a plurality of wire bonds for extending through the via extending through the substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connection to the plurality of bond pads of the bare semiconductor die and the plurality of circuit traces;
- and
- a plurality of electrical connectors located on the attachment surface of the substrate for electrically connecting the substrate and another substrate, the plurality of electrical connectors connected to the plurality of circuit traces.
An electrical assembly for connection to a substrate having a plurality of circuits comprising:
- at least two bare semiconductor die, each bare semiconductor die of the at least two bare semiconductor die having a surface having a plurality of bond pads located thereon;
- a substrate having a die side surface, an attachment surface, at least two vias extending through the substrate from the die side surface to the attachment surface, and a plurality of circuit traces, a portion of the surface having the plurality of bond pads of said each bare semiconductor die of the at least two bare semiconductor die attached to a portion of the die side surface of the substrate;
- a plurality of wire bonds for extending through each via of the at least two vias extending through the die substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connecting the plurality of bond pads of said each bare semiconductor die of the at least two bare semiconductor die and the plurality of circuit traces of the substrate;
- and
- a plurality of electrical connectors located on the die side surface of the substrate for electrically connecting the substrate and another substrate, the plurality of electrical connectors connected to the plurality of circuit traces.
An electrical assembly for connection to a substrate having a plurality of circuits comprising:
- a plurality of bare semiconductor die, each bare semiconductor die of said plurality of bare semiconductor die having a surface having a plurality of bond pads located thereon;
- a substrate having a die side surface, an attachment surface, a plurality of vias extending through the die substrate from the die side surface to the attachment surface, and a plurality of circuit traces, a portion of the surface having the plurality of bond pads of said each bare semiconductor die of said plurality of bare semiconductor die for attaching to a portion of the die side surface of the substrate;
- a plurality of wire bonds extending through each via of the plurality of vias extending through the substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connecting the plurality of bond pads of said each bare semiconductor die of said plurality of bare semiconductor die and the plurality of circuit traces of the substrate;
- and
- a plurality of electrical connectors located on the die side surface of the substrate for electrically connecting the substrate and another substrate, the plurality of electrical connectors for connection to the plurality of circuit traces.
An electrical assembly for connection to a substrate having a plurality of circuits comprising:
- a substrate;
- a bare semiconductor die having a surface having a plurality of bond pads located thereon;
- a substrate having a die side surface, an attachment surface, a via extending through the die substrate from the die side surface to the attachment surface, and a plurality of circuit traces, a portion of the surface having the plurality of bond pads of said bare semiconductor die for attaching to a portion of the die side surface of the substrate;
- a plurality of wire bonds extending through the via extending through the substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connection to the plurality of bond pads of the bare semiconductor die and the plurality of circuit traces;
- and
- a plurality of electrical connectors located on the attachment surface of the substrate electrically connecting the substrate and said substrate, the plurality of electrical connectors for connection to the plurality of circuit traces.
An electrical assembly for connection to a substrate having a plurality of circuits comprising:
- a substrate;
- a plurality of bare semiconductor die, each bare semiconductor die of said plurality of bare semiconductor die having a surface having a plurality of bond pads located thereon;
- a substrate having a die side surface, an attachment surface, a plurality of vias extending through the die substrate from the die side surface to the attachment surface, and a plurality of circuit traces, a portion of the surface having the plurality of bond pads of said each bare semiconductor die of said plurality of bare semiconductor die for attaching to a portion of the die side surface of the substrate;
- a plurality of wire bonds extending through each via of the plurality of vias extending through the die substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connecting the plurality of bond pads of said each bare semiconductor die of said plurality of bare semiconductor die and the plurality of circuit traces of the substrate;
- and
- a plurality of electrical connectors located on the die side surface of the substrate for electrically connecting the substrate and said substrate, the plurality of electrical connectors connected to the plurality of circuit traces.
Dependencies are inferred from the claim text.